Datacon, a supplier of advanced packaging equipment, and Ablestik, a supplier of adhesives and specialty materials for semiconductor packaging and microassembly applications, have joined forces to provide joint technological development and shared product evaluations and demonstrations to the marketplace. The aim of this partnership is to strengthen technological leadership, especially in processes such as thin die and/or stacked die handling as well as other advanced epoxy processes, and to advise customers of both companies on the best solutions for their production needs. The existing demo and laboratory sites of both partners — Datacon in Trevose, PA and Radfeld, Austria, and Ablestik in Rancho Dominguez, CA and Shanghai, China — will be open to both companies and their customers. In these process laboratories processes tailored to the specific needs of the customers can now be developed, evaluated and demonstrated. This process knowledge of Ablestik and Datacon is now available to the clients, which will result in faster time to market, higher yields and lower cost of ownership, the companies state.
www.datacon.at
