Package technology strengthens battery management MOSFETs

ALPHA AND OMEGA SEMICONDUCTOR MRigidCSP packaging technology for battery management applications is designed to decrease on-resistance while increasing mechanical strength. Firm initially provides this technology on its AOCR33105E,12V common-drain dual N-channel MOSFET. The robust package technology is particularly suited to battery applications in smartphones, tablets and ultra-thin notebooks. MRigidCSP package technology to be used with high-aspect ratio CSP die sizes, helping to alleviate one of the major causes of battery management application production problems.

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