Electronic Products & Technology


Keyword
materials


Product
February 20, 2020 by Stephen Law

High thermal gap pads boost conductivity in power designs

HENKEL BERGQUIST GAP PAD TGP 10000ULM thermal interface materials (TIMs) address the high power density challenges associated with new 5G telecom infrastructure and consumer mobility designs. Product’s formulation provides exceptionally high thermal conductivity of 10.0W/m-K within an ultra-low modulus, low…
News
February 8, 2020 by EP&T Magazine

Henkel expands portfolio with the Sonderhoff brand

Completed integration of the Sonderhoff portfolio into the Adhesive Technologies business unit
News
February 4, 2020 by EP&T Magazine

DuPont Interconnect Solutions expands sales efforts into Canada

Insulectro’s role in North America includes adding Canada to its Pyralux sales territory
News
January 26, 2020 by EP&T Magazine

DuPont Interconnect Solutions expands into Canada

Insulectro to roll out its Pyralux brand, expand its warehouse location here
News
December 12, 2019 by EP&T Magazine

MacDermid Alpha acquires Kester

Connecticut-based MacDermid Alpha Electronics Solutions has acquired Kester, a global supplier of materials used in electronics assembly and semiconductor applications. Kester, a division of Illinois Tool Works and based in Itasca IL, has manufacturing facilities in the U.S. and Germany…
News
August 24, 2019 by EP&T Magazine

GSC welcomes Canada’s use of a risk-based assessment of siloxanes

Regulators conclude L2, L4, L5 and D3 pose low risk to environment and human health
Feature
July 23, 2019 by Sam Million-Weaver, University of Wisconsin-Madison

Simple ‘smart’ glass reveals the future of artificial vision

Smart glass that can recognize images without requiring any sensors or circuits or power sources
News
April 29, 2019 by EP&T Magazine

Next gen material serves flexible touchscreen displays

ActiveGrid Gen 7 Ink boosts optical quality with enhanced flexibility
News
April 5, 2019 by Ryan Owens, University of Missouri

Teaching computers to intelligently design ‘billions’ of possible materials

A team of MU researchers are applying one of the first uses of artificial intelligence principles to the field of materials science
Product
March 23, 2019 by Stephen Law

Component adhesive boosts thermal conductivity

ENGINEERED MATERIAL SYSTEMS TM-6520 low temperature cure adhesive is designed for die attach and general circuit assembly applications. Product is electrically insulating and provides high thermal conductivity of 1.7 W/°K and cures in 60 minutes at 70°C or 20 minutes…
News
March 20, 2019 by Laura Arenschield, Ohio State News

Researchers discover new material to help power electronics

Findings could mean a revamp of the way engineers create all different kinds of electronic devices
Product
February 6, 2019 by Stephen Law

Ultra-low modulus thermal interface materials contain advanced resin

HENKEL BERGQUIST GAP PAD thermal interface materials (TIMs) comes in two ultra-low modulus, including TGP 6000ULM and TGP 7000ULM, both formulated with an advanced resin platform to deliver ultra-low modulus capabilities and high thermal conductivity of 6.0 W/m-K and 7.0…