Electronic Products & Technology


June 5, 2020 by Stephen Law

13W thermal gap filler come as gel-like sheets

FUJIPOLY AMERICA Sarcon GR130A high-performance, thermal gap filler pad is packed as highly conformable, gel-like sheets that exhibit a thermal resistance as low as 0.02°C•in2/W at 43.5 PSI with a thermal conductivity of 13 W/m°K. Product is available in five thicknesses…
November 25, 2019 by Stephen Law

Thermal gap fillers serve delicate components

FUJIPOLY AMERICA Sarcon Low Compression Force gap filler pads are suitable for applications that have delicate components or widely varying gap distances. TIMs help avoid overstressing the printed circuit board (pcb) and fragile solder joints as the interface material is compressed…
October 12, 2019 by Stephen Law

Thermal gap filler serves high power designs

FUJIPOLY AMERICA Sarcon GR80A-00-100GY is a 1.0mm thick thermal interface material that delivers a thermal conductivity of 13.0W/m•K with a thermal resistance of 1. 0° C•in2/W, which are often required in higher-power electronics applications. When placed between heat generating components…
April 6, 2019 by Stephen Law

Ultra-soft thermal gap filler is compressible

FUJIPOLY Sarcon PG25A soft and compressible thermal gap filler materials provide gel like consistency in a convenient sheet form. Product is suitable for applications that have delicate components and high compression rates. When it is sandwiched between components of varying…
November 23, 2018 by EP&T Magazine

New forms of education help Canada’s skills gap

Survey of tech professionals is the first to measure career outcomes of coding bootcamp graduates exclusively across Canada