Electronic Products & Technology


June 23, 2020 by Stephen Law

B-staged epoxy meets airbus standards

MASTER BOND EP36FR specialized one-part epoxy meets Airbus specifications for toxic gas emissions per AITM 3.0005, Issue 2 in the flaming mode and Section 7.4 of ABD0031, Issue F. Product passes the 12 second vertical burn test per AITM 2.0002B…
May 13, 2020 by Stephen Law

Outgassing rated epoxy enhances chemical resistance

MASTER BOND EP42-2LV Black two-part epoxy provides low viscosity and good flow, and it withstands prolonged immersion in many acids, bases, solvents, fuels and oils. The versatile system can be used for bonding, sealing, coating and casting, where a strong…
April 15, 2020 by Stephen Law

High elongation epoxy passes ISO 10993-5 certification for cytotoxicity

MASTER BOND EP40Med two component, biocompatible, two-part epoxy system is formulated for medical device manufacturing applications. Product combines toughness and a low tensile modulus, while still providing a relatively high lap shear strength. Product meets the requirements of ISO 10993-5…
March 17, 2020 by Stephen Law

Epoxy boosts chemical, heat resistance 

MASTER BOND EP35SP two-part epoxy system for bonding and sealing applications, provides resistance to many chemicals such as oils, acids, bases, water, fuels, and especially petrochemicals. Product delivers both a high glass transition temperature (Tg) and a broad service temperature…
November 25, 2019 by Stephen Law

Underfill epoxy delivers thermal conductivity, electrical insulation

MASTER BOND EP29LPTCHT two component, low viscosity epoxy compound can be utilized for underfill and encapsulation applications. Product does not need excessive heat for curing and has a long working life at room temperature. System is electrically insulative and thermally…
November 12, 2019 by Stephen Law

Chemically resistant epoxy sealant is thermally conductive

MASTER BOND EP62-1AO two-part epoxy adhesive and sealant with a long working life of 12-14 hours at ambient temperature for a 100 gram mass. This makes it beneficial when bonding and sealing large or intricate parts that may need ample…
October 15, 2019 by Stephen Law

Thermally conductive potting compound resists high temperatures

MASTER BOND Supreme 121AO NASA low outgassing approved epoxy is suitable for bonding, sealing and potting applications. Featuring a high glass transition temperature of 200-210°C, product resists temperatures up to 550°F. This system exhibits an element of toughness and is…
September 18, 2019 by Stephen Law

Hybrid epoxy boosts chemical resistance

MASTER BOND EP21TP-2NV two part epoxy polysulfide is formulated for use as an adhesive, sealant and potting system. Product withstands prolonged exposure to many harsh chemicals including fuels, oils, hydrocarbons and hydraulic fluids. It is also fully RoHS compliant, meeting…
June 10, 2019 by Stephen Law

Optically clear, low viscosity epoxy system boosts flexibility

MASTER BOND EP88FL two component epoxy is a highly flexible, optically clear compound formulated for bonding, coating, sealing, potting and encapsulation. Easy to use, with a mixing ratio of one to one by weight or volume, product withstands thermal cycling…
March 13, 2019 by Stephen Law

Silver conductive, one component epoxy cures at 80°C

MASTER BOND Supreme 3HTS-80 one part, silver filled epoxy adhesive is not premixed and frozen and features an unlimited working life at room temperature. Product cures at 175°F to 185°F within 2-3 hours – unlike typical heat activated epoxies that…
February 24, 2019 by Stephen Law

Epoxy resin increases high temperature performance on advanced materials

SUN CHEMICAL EPICLON HP 4770 multi-functional naphthalene epoxy resin increase high temperature performance in aerospace, transportation and electronics applications. Product provides high modulus/stiffness, low water absorption, improved mechanical properties, adhesion and good fiber wet out— all critical factors to success…
January 15, 2019 by Stephen Law

Thermally conductive underfill epoxy lowers viscosity to 5,000-15,000 cps

MASTER BOND EP3UF-1 single component epoxy is not premixed or frozen and provides a low viscosity of 5,000-15,000 cps. The heat curable thixotropic compound is suitable for underfill and many bonding applications. Product delivers high bond strength and dimensional stability…