Epoxy adhesive lowers thermal resistance, meets NASA outgassing specs

MASTER BOND Supreme 18TC single component epoxy adhesive contains a blend of special thermally conductive fillers. The smooth paste system can be applied in bond lines as thin as 10-15 microns. Product provides low thermal resistance of 5-7 x 10-6 K•m2/W and a thermal conductivity of 22-25 BTU•in/ft2•hr•°F [3.17-3.61 W/(m·K)]. Heat transfer capabilities of this product are outstanding. Product passes NASA low outgassing tests and maintains high bond strength properties even when exposed to hostile environmental conditions, including high/low temperatures. It bonds well to a wide variety of substrates including metals, composites, ceramics and plastics. http://www.masterbond.com/tds/supreme18tc