Electronic Products & Technology


June 10, 2019 by Stephen Law

Optically clear, low viscosity epoxy system boosts flexibility

MASTER BOND EP88FL two component epoxy is a highly flexible, optically clear compound formulated for bonding, coating, sealing, potting and encapsulation. Easy to use, with a mixing ratio of one to one by weight or volume, product withstands thermal cycling…
May 6, 2019 by Stephen Law

Dual curing epoxy meets biocompatibility, cytotoxicity needs

MASTER BOND UV22DC80-1Med single component, nanosilica filled compound features a UV and heat curing mechanism. Product passes USP Class VI tests for biocompatibility, while also meeting ISO 10993-5 for cytotoxicity, making it suitable for many applications in the medical device…
May 22, 2018 by Stephen Law

2 component, electrically conductive silicone compound bonds, seals

MASTER BOND MasterSil 154 two component, silver colored, electrically conductive silicone compound provides high performance bonding and sealing. The modified silicone resin, includes a liquid curing agent that cures at ambient or more quickly at elevated temperatures to a tough,…
September 14, 2017 by Stephen Law

Thermal gap filler is easy to apply, form-in-place

FUJIPOLY  SARCON SPG-20A is an easy to dispense, low-viscosity silicone compound that exhibits a thermal conductivity of 2.0W/m°K and a thermal resistance of 2.1°K•cm2/W. When applied between heat-generating components and a nearby heatsink or spreader, the form stable thermal material…