Electronic Products & Technology


Keyword
compound


Product
June 10, 2019 by Stephen Law

Optically clear, low viscosity epoxy system boosts flexibility

MASTER BOND EP88FL two component epoxy is a highly flexible, optically clear compound formulated for bonding, coating, sealing, potting and encapsulation. Easy to use, with a mixing ratio of one to one by weight or volume, product withstands thermal cycling…
Product
May 6, 2019 by Stephen Law

Dual curing epoxy meets biocompatibility, cytotoxicity needs

MASTER BOND UV22DC80-1Med single component, nanosilica filled compound features a UV and heat curing mechanism. Product passes USP Class VI tests for biocompatibility, while also meeting ISO 10993-5 for cytotoxicity, making it suitable for many applications in the medical device…
Product
May 22, 2018 by Stephen Law

2 component, electrically conductive silicone compound bonds, seals

MASTER BOND MasterSil 154 two component, silver colored, electrically conductive silicone compound provides high performance bonding and sealing. The modified silicone resin, includes a liquid curing agent that cures at ambient or more quickly at elevated temperatures to a tough,…
Product
September 14, 2017 by Stephen Law

Thermal gap filler is easy to apply, form-in-place

FUJIPOLY  SARCON SPG-20A is an easy to dispense, low-viscosity silicone compound that exhibits a thermal conductivity of 2.0W/m°K and a thermal resistance of 2.1°K•cm2/W. When applied between heat-generating components and a nearby heatsink or spreader, the form stable thermal material…