Electronic Products & Technology


October 15, 2019 by Stephen Law

Thermally conductive potting compound resists high temperatures

MASTER BOND Supreme 121AO NASA low outgassing approved epoxy is suitable for bonding, sealing and potting applications. Featuring a high glass transition temperature of 200-210°C, product resists temperatures up to 550°F. This system exhibits an element of toughness and is…
August 28, 2019 by Stephen Law

UV curable system is not oxygen inhibited

MASTER BOND UV10TK40M one part UV curable system is not oxygen inhibited and can be used for bonding, sealing and coating applications. Product is optically clear, with a refractive index of 1.55. It has a high glass transition temperature (Tg)…
July 10, 2019 by Stephen Law

Toughened epoxy system bonds, seals, coats, encapsulates

MASTER BOND Supreme 3CCM-85 toughened, one part epoxy system can be used for bonding, sealing, coating and especially glob tops and small encapsulation. The curing temperature for this system is 175-185°F for 2 to 3 hours, rather than the typical…
July 23, 2018 by Stephen Law

Type AuR gold ribbon bonding wire fabricated to 4N specs

TANAKA PRECIOUS METALS  Type AuR Gold Ribbon Bonding Wire is fabricated to 4N specifications with 99.99% purity using a dry process. Sizes range from 12.7µm to 50µm thickness, and widths range from 25µm to 250µm wide. Product is typically packaged…
August 3, 2017 by Stephen Law

Two part epoxy bonds, seals and coats encapsulation

MASTER BOND EP41S-F is a two part epoxy for bonding, sealing, coating and encapsulation applications. Product combines fast ambient temperature cure speed with  chemical resistance and superior electrical insulation properties. Versatile system is easy to handle and has a forgiving…