Electronic Products & Technology

Antenna grade laminates reduce PIM, lower insertion loss

EP&T Magazine   

Electronics

ROGERS CORP. RO4700JXR Series antenna grade laminates combine low-loss dielectric with low-profile copper foil for reduced passive intermodulation (PIM) and low insertion loss. Product’s specially formulated thermoset resin system incorporates a hollow microsphere filler resulting in a light weight, low density laminate, which is approximately 30% lighter weight than woven-glass PTFE materials. RO4725JXR (2.55Dk) & RO4730JXR (3.0 DK) laminates provide a lower cost solution for high frequency circuit boards used in base station and other antennas.

http://www.rogerscorp.com

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