Electronic Products & Technology


Voids in Solder Joints: Webinar

Event Type

More Events
Print this page

May 03, 2023

Voids in Solder Joints and Their Impact on Assembly Reliability

Hosted by IPC Association

Begins at 10:00 a.m. Central time

Join us for this informative webinar as explaining the significance of measuring both voiding and coverage of solder joints. We will explore the data behind IPC J-STD-001HA/-A-610HA that supports reliability concerns and highlight the importance of understanding the meaning behind coverage versus voiding.

We will also touch upon where in the industry there is adoption and implementation of these measurements. Don’t miss this opportunity to gain valuable insights into this critical aspect of electronics manufacturing.

*A recording will be made available to all registrants.

Presented by Norbert Holle

With an educational background in process engineering, Norbert Holle has been dealing with numerous material and process engineering topics in assembly and interconnect technology for automotive electronics at Robert Bosch GmbH, Germany. The focus of industry research and development projects is the improvement of SMT process, soldering defects, solder joint voiding, humidity-induced failures, PCBA cleaning, and interactions between process and PCB. Several of these activities have been published at international conferences and results have been introduced into IPC standard definitions. Holle has gained further experience in the high-temperature processing of metals and ceramics for electronic and automotive applications.

Visit event's website

Print this page