Voids in Solder Joints: Webinar
May 03, 2023
Voids in Solder Joints and Their Impact on Assembly Reliability
Hosted by IPC Association
Begins at 10:00 a.m. Central time
Join us for this informative webinar as explaining the significance of measuring both voiding and coverage of solder joints. We will explore the data behind IPC J-STD-001HA/-A-610HA that supports reliability concerns and highlight the importance of understanding the meaning behind coverage versus voiding.
We will also touch upon where in the industry there is adoption and implementation of these measurements. Don’t miss this opportunity to gain valuable insights into this critical aspect of electronics manufacturing.
*A recording will be made available to all registrants.
Presented by Norbert Holle
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