SMTA Ontario Chapter Technical Webinar
December 07, 2022
LGA Void Reduction via Optimization of Solder Paste Deposition
It is no secret that voiding under bottom terminated components continues to be an issue for many electronics manufacturers. A tried and true technique that aids in void reduction focuses on optimizing the solder paste deposition via aperture modification. In this session, Emily will walk us through some case studies in which this technique showed significant voiding improvement under land grid arrays (LGAs).
Emily Belfield is the Northeast Regional Sales Manager for Indium Corporation and is responsible for maintaining existing sales and driving new qualifications and sales through effective account management and coordination of resources. She joined Indium Corporation in 2020 as a Technical Support Engineer where she provided technical assistance to resolve soldering process-related issues. Emily earned her bachelor’s degree in Chemical Engineering at Syracuse University.
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