Electronic Products & Technology


PCB Design – Implementing 3D: SMTA

Print this page

March 30, 2022

SMTA International Professional Development Course

PCB Design for Implementing 3D and High Density Semiconductor Package Technologies

Wednesday, March 30 at 10:00am (US Central)
Presenter: Vern Solberg of Solberg Technical Consulting

Product developers looking for higher functionality and reach their performance and miniaturization goals are relying more on higher density semiconductor package innovations. Although integrating several semiconductor functions onto a single die element (System-on-Chip) appears to provide a viable solution for some, development cost and time has often proved to be excessive. For that reason, many manufacturers will rely heavily on more innovative IC package solutions, often integrating a number of already proven functional elements within a single-package outline.

This capability has been stimulated by the rapid deployment of new semiconductor packaging innovations from a broad number of domestic and offshore competing companies’ that understand that new product time-to-market can be the difference between leading and following.

This tutorial addresses the PCB design and assembly challenges for developing and implementing a broad range of high-density semiconductor package methodologies including flip-chip and array configured, multiple function 3D System-in-Package (SiP) technologies.

Topics covered

1. BGA/CSP Process Technologies and Standards
– Single Die BGA and FBGA Packaging
– Flip-Chip and Die Size Package Technologies
– Wafer Level Packaging (WLP)
– Fan-Out Wafer level Packaging (FOWLP)
– JEDEC Package Outline Standards

2. Innovative Solutions for 2D, 2.5D and 3D Packaging
– 2D BGA Package Technology
– 3D Multiple Die and Stacked Package Methodologies
– Implementing 2.5D for High Density BGA Applications
– Silicon Based Interposer Structures
– Glass Based Interposer Structures
– Organic (Laminate) Based Interposer Structures

3. Printed Circuit Board Design Guidelines for HDI
– Ball Grid Array (BGA)
– Fine Pitch Ball Grid Array (FBGA and DSBGA)
– Flip-Chip (WLP/FOWLP)
– 2.5D Interposer structures

4. HDI Circuit and Micro PCB Design Implementation
– HDI Circuit Fabrication Variations
– Micro PCB Process Methodology
– Design Guidelines for HDI Circuits
– HDI Sources and Economic Issues

5. Specifying PCB Base Material, Surface Finish and Coatings
– Organic base material selection criteria
– Specifying thickness of copper foils
– Surface plating and coating variations
– Solder mask process considerations

6. Preparation for High Volume Assembly Processing
– Surface Mount Assembly Process Overview
– Basic features needed for SMT assembly processing
– System requirements for BGA and CSP device placement
– Palletizing to maximize assembly process efficiency
– Assembly process implementation

The material presented has been developed to better enable the product designer and manufacturing specialist to evaluate a broad number of semiconductor packaging methodologies. The examples shown will furnish both physical and monetary benefits gained using multiple die packaging as well adverse concerns related to supply-chain obstacles and infrastructure limitations.

Intended Audience

This coarse will benefit PCB Designers, Design Engineers and those responsible for semiconductor package and electronic product development, assembly processing and manufacturing efficiency as well as manufacturing and test engineering specialists for the OEM, ODM, EMS and OSATs (Outsourced Assembly and Test) providers.

Visit event's website

Print this page