May 09 - May 11, 2016
8500 Warden Avenue Toronto, ON L6G 1A5 Canada

Event hosted by the SMTA

Suggested Topics to be covered include:
* Lead-free Assembly Processes, including Test
* Solder Joint Reliability under Temp Cycling, Mechanical Shock/Drop, After Aging
* Harsh Environment
* Tin Whiskers
* Electromigration
* Thermal Dissipation
* Environmental Compliance/Regulations
* Conformal Coating
* Nano-interconnects
* Package on Package
* Manufacturing Process
* Mechatronics
* Corrosion
* Halogen-Free Laminates
* High Density Interconnects
* Thermal Interface Materials
* Chip and Board Level Underfills, including solder joint encapsulants
* Printed Electronics
* Lead Free Die Attach Soldering
* Nano-scale Soldering Materials and Processes
* New Solder Paste Technologies
* Flex Circuits soldering and assembly
* Wearables
* Entertainment Systems
* LEDs (Assembly, Reliability, Testing)
* Robots/Drones

*Alternative Interconnects

Exhibit Hours:
Tuesday, May 10, 2016: 10:00am – 3:30pm

If you are interested in presenting, please submit a 200-300 word abstract towww.smta.org/icsr/abstracts. Include a title, author name and contact information with your abstract. Authors will be notified of acceptance by February 15, 2016. Technical papers and presentations are required and will be due on March 21, 2016. www.smta.org/ICSR