iMaps Boston 2019
September 30 - October 03, 2019
52nd International Symposium & Expo on Microelectronics
The 52nd International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). As our industry grows, we see a continuing trend where semiconductor products span many packaging platforms. As a result, we have maintained last year’s technical program format where the tracks are alignment by package platform to improve the overall attendee’s experience. Key package platforms include SiP/SiM/CPI, Wafer Level/Panel Level, 2.5D/3D/Flip Chip/Optical, as well as High Rel/Performance and Advanced Process/Materials. The technical committee has put together over 125 technical presentations and posters on today’s most relevant topics in five parallel technical tracks.
This is an exciting time to be part of the microelectronics assembly and test supply chain as our industry becomes increasingly international and cross-disciplined. The advancements in connectivity continue to enhance our personal and professional lives. This, in turn, presents new challenges and opportunities for innovative solutions where the IMAPS community can experience and contribute. Mark your calendar now for September 30-October 3, and see you in BOSTON.
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