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Creep Corrosion in Electronics: Webinar

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May 01, 2024


Engineering Webinar Series host by IPC

This is a 60-minute webinar presented by IPC at 1:00 p.m. ET

Speakers: Sean Clancy, Ph.D., Christopher Genthe, Paul Leone, and Randy Schueller Ph.D.

Topic: Creep Corrosion in Electronics – A Panel Discussion A group of industry experts will discuss the evidence of the root causes of creep corrosion, relevant testing, and effective mitigation strategies available to prevent creep corrosion failures in electronics. Fundamentally, creep corrosion is the product of the reaction of copper with sulfur, which may be mitigated with manufacturing processes, such as the printed circuit board solder mask and surface finish, conformal coating, and enclosure levels, as well as during end use operation, such as filtration. Several types of harsh environmental test methods that are used to evaluate for product susceptibility to creep corrosion will also be reviewed. Can’t make the live session? No problem! Register and you will receive a link to the recording via email. This recording will also be posted on the “Members Only” portion of the IPC website.

 



Visit event's website
https://ipc.zoom.us/webinar/register/WN_jhAennppSU2BHDIsDM39qw#/registration




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