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Partnership creates new approach for chip-down design
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Intuitive software development kit lets designers develop customized haptic effects
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Standard brings low power, high-performance interfaces to drones, mobile robots, mobile test equipment
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Kongsberg Discovery and Dorigo Systems deliver exceptional performance in extreme environments
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TELEDYNE FLIR Lepton UW micro-thermal camera module with an ultrawide 160-degree field of view (FOV) is small enough to fit on the tip of a finger. The ultra-wide module provides very small size, weight, and performance
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NXP SEMICONDUCTORS S32K3 MCUs of 32/bit AEC-Q100 qualified MCUs combine a scalable family of Arm Cortex-M7-based microcontrollers in single, dual and lockstep core configurations
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HIROSE BK22 Series miniature hybrid flexible printed circuit (FPC) to board connector family to simplify mating and provide design flexibility. Combing space savings and a high-power capacity
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NANOTEC NME3 compact magnetic encoder delivers modular design, allowing it to be combined with a wide range of brushless dc and stepper motors – starting from flange size NEMA 8.
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October 26, 2023 | 4141 Living Arts Dr, Mississauga, ON L5B 4B8
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