Category
Thermal management
Product
Cooling units boost efficiency, deliver output range of 2 to 6kW
RITTAL Blue e+ series of cooling units enhances efficiency by 75% with an output class of 1.6 kW. Products improve performance in terms of connectivity, safety and handling. In addition to the CULUS listing, units also have a UL listing…
Product
Thermoelectric modules deliver precise laser diode cooling
LAIRD OptoTEC Series Thermoelectric module (TEM) accommodates a laser diode butterfly package. Primarily used to stabilize the temperature of sensitive optical components in telecom and photonics industries, device is designed for applications that have lower cooling requirements of 10 watts…
Feature
11 Myths about the MicroTCA backplane-based architecture
This article helps clear up misunderstandings and misconceptions surrounding the high-performance MicroTCA backplane-based embedded architecture.
Product
Thermal interface material available in sheets, custom sizes
FUJIPOLY AMERICA Sarcon GR14A-50GY low-cost general purpose thermal interface material comes in sheets or custom shapes to fit specific design requirements. When placed between heat-generating components and a nearby heatsink, this 0.5mm thick, highly conformable gap filler pad can transfer…
Product
PC software simplifies EMC pre-compliance testing
SAELIG EMCView PC Software simplifies the process of EMC pre-compliance testing of radiated and conducted emissions. EMCView complements an emissions test setup of a spectrum analyzer, an LISN (Line Impedance Stabilization Networks) and an EMI-quiet TEM (Transverse ElectroMagnetic) Cell. Built-in…
Product
Infrared cameras capture, display smaller temperature differences
FLUKE Ti450 and Ti480 PRO Series Infrared Cameras have increased thermal sensitivity to capture minute differences and on-screen clarity to make it easy to visualize issues in the field. Devices deliver enhanced measurement accuracy and a temperature range of up to…
Product
FIR sensor accurately measures thermal output
MELEXIS MLX90632 family of miniature far infrared (FIR) sensors can be used in multiple applications where accurate temperature measurement is required. Based upon firm’s established FIR technology that utilizes the fact that every object emits heat radiation, the ultra-small integrated…
Product
Low-profile, open-fin IC coolers are light-weight
JARO THERMAL JAC00057 series of light-weight 71mm (L) x 52mm (W) x 11mm (H) open-fin IC coolers are suitable for low-profile applications. Device provides a low ‘noise to CFM’ ratio and is suitable for cooling BGA, graphic and embedded processors and other ICs…
Product
Software system delivers real-time insight into reflow, wave soldering
KIC Vantage network software system provides a real-time dash-board for thermal processes, accessible anywhere, from any authorized PC or mobile device. The process data is automatically stored in a central location where the engineer can quickly retrieve and share all…
Product
OpenVPX development ATR enclosure is conduction-cooled
PIXUS TECHNOLOGIES ATRD058HEX-3U low-cost demonstration and development ATR (Air Transport Rack) for conduction-cooled 3U or 6U OpenVPX systems. Enclosure includes rear fans for supplemental cooling of high-power cards. Product provides a 6-slot 3U OpenVPX backplane to PCIe Gen3 (8 Gbps)…
Product
Circuit materials electrical, thermal/mechanical demands
ROGERS RO1200 circuit materials meet the electrical and thermal/mechanical demands of high-speed designs, helping to maximize data throughput and minimize latency. With a low dielectric constant (Dk) of 3.05 and a maximum dissipation factor of 0.0017 @10 GHz, products provide…
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