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IEDM to showcase breakthroughs in semiconductor technology

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2018 IEEE International Electron Devices Meeting to unveil breakthroughs and new concepts in transistors and related micro/nanoelectronics devices

Novel neuromorphic and 3D devices, along with advances in memories and in core integrated circuit technology, are among the highlights of the upcoming 64th annual IEEE International Electron Devices Meeting (IEDM), an influential forum for the unveiling of breakthroughs and new concepts in transistors and related micro/nanoelectronics devices. 

The 2018 IEDM will be held December 1-5, 2018 at the Hilton San Francisco Union Square hotel. With 230 scheduled presentations, the conference’s tradition of spotlighting more leading work in more areas of the field continues, even as it evolves to support the interdisciplinary and continuing educational needs of today’s scientists, engineers and students.

Some of today’s most important areas of research

“This year’s program shines the spotlight on diverse technology advances that are driving the electronics industry forward, such as neuromorphic and 3D integration; device concepts for 3nm; progress in many types of advanced memories; new high-mobility channel materials, interconnect strategies; and many others,” says Kirsten Moselund, IEDM 2018 publicity chair and research staff member at IBM Research–Zurich. “Also, this year the IEDM once again will feature special sessions of invited papers focused on some of today’s most important areas of research. This year’s Focus Session topics are quantum computing, 5G wireless communications, wide-bandgap power devices, and the future of interconnects.”

“Apart from the technical program itself, the 2018 IEDM offers many other opportunities to gain insight into new technologies, to interact with technology leaders, and to take part in stimulating discussions,” said Rihito Kuroda, IEDM 2018 Publicity Vice Chair and Associate Professor at Tohoku University. “The weekend tutorials and Short Courses, for example, provide outstanding opportunities to learn what is happening at the frontiers of many different technologies. The Tuesday evening panel offers the chance to debate the future of EUV patterning technology with key technologists, while a new luncheon format earlier that day provides the opportunity to hear industry leaders give their personal career reflections. Also, a supplier exhibition will be held once again to showcase products and services which support the industry.”

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For more details of the 2018 IEDM, visit:

www.ieee-iedm.org

 

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