C2MI to add stealth dicing among its capabilities
MiQro Innovation Collaborative Center (C2MI) Bromont QC-based laboratories is adding new equipment that will permit stealth dicing – a laser-based technique used to dice silicon wafers.
The fully automatic laser saw, a DFL 7340 unit from Disco Corporation in Japan, uses a technique that has several benefits. Among others, it offers a dry process, so it doesn’t use water for processing and cleaning. Also, there is little or no damage to the die front and back surface. The saw also allows an improved exploitation of the wafer surface due to smaller kerf loss compared to the wafer saw.
The MiQro Innovation Collaborative Centre was announced in 2009, after obtaining a $218-million grant from the Ministère du Développement économique de l’Innovation et de l’Exportation (MDEIE) ($94.9M), Industry Canada ($82.95M) and privates partners (Université de Sherbrooke, IBM Canada Ltd and Teledyne DALSA) and several equipment partners as part of Canada’s Knowledge Infrastructure Program.
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