Canada’s National Optics Institute adds new Sigma bonding system
The National Optics Institute (INO), Canada’s largest center of expertise in optics and photonics, recently added a FinePlacer Sigma bonding system at its micro-opto-electromechanical systems facility in Quebec City.
The semi-automatic die bonder from Finetech will be used by researchers and developers specializing in micro-electromechanical systems (MEMS) and MOEMS. Over the past 20 years, INO has been developing an expertise in packaging of MOEMS and integrated optics. INO’s packaging solutions are used in several industries, including space industry, telecommunications, biomedical, natural resources, defense and security.
High-accuracy flip chip bonder
“The addition of Finetech’s high-accuracy flip chip bonder to INO’s current toolkit will enhance its current offering for many types of heterogeneous integration and photonic advanced packaging,” says Bruno Fisette, Research Scientist MOEMS. “Thanks to the state-of-the art precision placement and the significant versatility of the system, this will be an essential tool to meet many custom assemblies required by our various clients.”
The FinePlacer Sigma is suitable for high-density array applications and high bond force (up to 1000N) requirements, coupled with the firm’s sub-micron placement accuracy. The system serves a wide variety of Wafer Level Packaging (FOWLP, W2W, C2W) with high bump count used to assemble MEMS/MOEMS, IR/ image sensors, focal plane arrays, and high power device packaging.