Spring conference focuses on printable, flexible & wearable electronics
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CPES2017 coming to Centennial College in Toronto May 24-25
The Canadian Printable Electronics Industry Association (CPEIA) has announced it will host its second annual conference and trade show exhibition for printable, flexible and wearable electronics (PE) on May 24-25 at Centennial College’s new conference centre in Toronto.
More than 100 organizations and 200 attendees are expected to participate in CPES2017, with industry-leading speakers and keynotes from around the world. This will of course include many of our 80 CPEIA member organizations that are working on a wide range of solutions to power your innovation.
Master classes in various technical subjects
In addition to two days of technical programming targeted at academics, PE industrial companies and end-use companies alike, CPES2017 will feature on May 26, a third day of master classes in various technical subjects, as well as mentoring sessions for startup companies.
The CPES2017 website, with early bird registration and the call for speakers, will launch shortly. We will once again offer spots for academic posters, even more tabletop exhibitors than last year and feature the next edition of the CPES Innovation Awards.
“CPES2017 will continue to build on the success and positive energy of last year’s event,” says Peter Kallai, president and CEO of the CPEIA and chair of the CPES organizing committee. “CPES2017 is the place for PE industrial companies and end-users to meet and discuss how they can work together to commercialize new products and applications. We also hope to see a strong turnout from the academic community – this is the place to learn how they can link their research to market needs and opportunities.”
Agenda will cover the broad spectrum of PE technologies
Once again, the agenda will cover the broad spectrum of PE technologies and the value chain required to bring innovative products and applications to market.
* 2D large area and 3D printable electronics
* Advances in inks, pastes, substrates, manufacturing methods
* Advances in flexible electronics
* Advances in wearable electronics
* Advances in components such as sensors, batteries, lights, displays antennas and memory.
* Hybrid electronics that connect printable and flexible electronics with integrated circuits or traditional electronics
Applications in key end-use applications will be featured in:
* Intelligent packaging
* Intelligent buildings
* Aerospace and defence
* Health and wellness and wearables