The SMTA is pleased to announce the program for the 10th Annual International Conference on Soldering and Reliability being held on May 9-11 in Toronto, co-located with the SMTA Toronto Expo.
The technical conference features presentations on topics including bismuth-containing solders, micro solder technologies, production assembly processes, soldering processes, polymeric materials, reliability and conformal coating. Speakers represent companies including BAE Systems, Celestica Inc., Honeywell International Inc., IBM Cor., and Rockwell Collins, and schools including Binghamton University, University of Maryland-CALCE-EPSC, University of Seoul, University of Toronto and University of Waterloo.
Michael Osterman, Ph.D., CALCE/University of Maryland, will deliver the Keynote Presentation “Remaining Issues with Pb-Free Electronics” on Tuesday, May 10.
Workshops on Monday, May 9, will include:
* Shining a Light on LED Technology: Construction, Reliability, Qualification, Failure Modes Process Material
* LGA and QFN Component Technology: Manufacturing Implementation and Solder Joint Reliability
* Designing in Reliability by Assessing Contamination at the Component Interface
The SMTA Toronto Expo and Tech Forum will run in conjunction with the ICSR program on Tuesday, May 10. Conference participants may attend the expo for no charge. Complimentary technical presentations will be offered. Check online for more details and the agenda.
The Early Bird registration deadline is April 8th. For more information or to register visit:
Contact Jenny Ng at 952-920-7682 or jenny@smta.org with questions.
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
