Electronic Coating Technologies and LPMS-USA align to bring low pressure molding into Canada
LPMS-USA’s president Michael Cooper formed the company last year to bring the latest in low pressure molding technology to a U.S. market in need of a better solution to encapsulating electronic components, says Tom Charlton, president of Electronic Coating Technologies. Charlton draws from 30 years in the adhesive and coatings industry to understand the impact of LPMS-USA and the latest in low pressure molding technology on overmolding and encapsulating manufacturing.
“We look forward to adding LPMS-USA low pressure molding solutions to our offerings at ECT, the product line is synergistic to our Capital Equipment Representation and Subcontract Encapsulation Services,” Charlton says.
Charlton opened Electronic Coating Technologies in 1997 to bring to the electronics market a company whose staff would bring many years of expertise in conformal coatings, potting compounds, gaskets, adhesives and equipment. His vision was to offer a service to help small to large sub contract assembly houses, OEM’s and other manufacturers together to deal with the complex issues of applying chemical compounds to assemblies in a safe, environmentally responsible and repeatable way.
LPMS-USA operates as a full-service low pressure molding solution provider offering in-house machines, mold fabrication services, as well as contract manufacturing services. Research has indicated a need to protect circuit boards, electrical components and batteries from moisture and vibration, as well as provide strength to delicate wire harnesses and connectors. The low pressure molding process requires no housing, uses less material than traditional potting processes and can produce finished parts in seconds.
LPMS-USA has more than 25 custom machine options—from R&D prototype units to large production units, the ability to fabricate a mold within 15 business days and a dedicated engineering team to assist with design modifications and recommendations.