Electronic Products & Technology

Design Technology Tackles Miniaturization, Low-Power Challenges

August 20, 2008  Staff

Cadence Design Systems Inc. has announced its SPB 16.2 release, which focuses on addressing current and emerging chip package design challenges. This latest release delivers advanced IC package/system-in-package (SiP) miniaturization, design cycle reduction and DFM-driven design, along with a power integrity modeling solution. These capabilities are designed to boost productivity of digital, analogue, RF and mixed-signal IC package designers involved in single and multi-die packages/SiPs. Design teams can expect improvements in the reduction in overall package size through the introduction of rules and constraint-driven automation capabilities that address the design methodology of high-density interconnect (HDI) substrate manufacturing that is a key enabler for miniaturization and increased functional density. The new power integrity technology allows designers to efficiently address the power-delivery design goals of sufficiency, efficiency and stability.
www.cadence.com


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