PHOTOETCHING BOARD LEVEL SHIELDING
Tech-Etch uses cost-saving photoetching to manufacture board level shielding components such as custom fences with removable covers.
The photoetching process improves design flexibility, shortens lead times, and eliminates hard tooling costs. Prototypes are available in five days. In addition, photoetching allows the fabrication of board level shielding components with close tolerances that duplicate stamping without the high tool cost. Fences, covers and mounting pins can be designed in any configuration, as can through holes, slots and internal dividers. Depth-etch bend lines facilitate hand forming, and soldered or resistance welded seams are available.