Electronic Products & Technology

Enclosure Design

June 14, 2006  Staff

New technologies are wreaking havoc in the enclosure world.  Faster and hotter processors are bringing cooling, EMI/RFI, and configuration challenges to the forefront. Coupled with the unrelenting desire to save space and package more electronics into smaller dimensions, this is a recipe for trouble. Enclosure companies today need to utilize more resources to address these market needs.

 


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