CPS Corp. offers AlSiC (Aluminum Silicon Carbide), a metal matrix composite suited as a thermal management material for insulated gate bipolar transistor (IGBT) base plates.
These plates can be used in high-power traction, power control, and fly-by-wire applications, which require thermal performance reliability. The IGBT baseplates are light weight and offer high strength. The thermal performance reliability AlSiC composites offer is ideal for the production of high reliability military electronics. AlSiC’s tailored, isotropic coefficient of thermal expansion (CTE) can be adjusted for specific applications by modifying the Al-metal/SiC-particulate ratio to match the CTE of the die or substrate.