Low-temp cure conductive adhesive aids static drain, EMI/RFI shielding
Stephen Law
Production / Materials EngineeringEMS 618-116 low-temperature cure one-part conductive adhesive for circuit assembly applications can cure in 30-minutes at 100°C or rapidly at elevated temperatures. Product forms high-strength, high-reliability conductive interconnects. http://www.emsadhesives.com
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