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Low-temp cure conductive adhesive aids static drain, EMI/RFI shielding
ENGINEERED MATERIALS SOLUTIONS


EMS 618-116 low-temperature cure one-part conductive adhesive for circuit assembly applications can cure in 30-minutes at 100°C or rapidly at elevated temperatures. Product forms high-strength, high-reliability conductive interconnects. http://www.emsadhesives.com

EMS (Engineered Materials Systems)

 

 

 


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