Jetting solder paste requires no cleaning

AIM J8 No Clean Jetting Solder Paste is specifically formulated for use in collaboration with a variety of jetting paste equipment manufacturers. Product has proven to provide consistent solder deposits as small as 200μm and is fully compatible with all of firm’s no clean solder pastes for use in applications where combining jetted paste deposits with printed paste deposits is required.  Product provides an activator system that delivers powerful, durable wetting action accommodating a wide range of profiles producing bright shiny joints without graping defects.  Product reduces voiding to as low as <5% on BGA and <10% on BTC ground pads. http://www.aimsolder.com