Insulative underfill epoxy is thermally conductive

MASTER BOND EP3UF one component epoxy contains thermally conductive fillers with very small particle sizes imparting a low thermal resistance of 5-7 x 10-6 K•m2/W. The low viscosity system has good flow properties and can be applied in bond lines as thin as 10-15 microns. Product provides a thermal conductivity of 9-10 BTU•in/ft2•hr•°F [1.30-1.44 W/(m·K)] and a volume resistivity exceeding 1014 ohm-cm. Product passes NASA low outgassing tests and can be used for bonding and underfills in microelectronics packaging/assembly applications. http://www.masterbond.com