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High performance backplanes resist shock, vibration


Bustronics Rear Transition Modules (RTM) high performance backplanes in VPX, VME64x, VME, CompactPCI and custom architectures. Product brings IO signals out the rear side of the backplane and provides higher resistance to shock and vibration (compared to a ribbon cable connection style) by directly plugging into the backplane. Possible sizes include 3U x 80 mm, 6U x 80mm, 8U x 80mm and more depending on architecture. Modules come with or without injector/ejector handles. These handles help the board lock securely into place and the panel provides atractive aesthetics.

http://www.Bustronic.com


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