Heat sinks come in extruded, stamped versions

CUI Aluminum heat sinks are available in both extruded and stamped versions, are compatible with TO 218, TO 220, TO 252 and TO 263 transistor packages. Designed to improve the heat dissipation of low and high power board level applications, these stampings and extrusions are conveniently measured under four conditions for thermal resistance, making it easier to select the optimal heat sink for natural convection or forced air cooled systems. Both extruded and stamped versions provide tin plated or black anodized material finishes and are available with or without solder pins in vertical or horizontal orientations. Thermal resistances measured at 75°C ΔT in natural convection environments are as low as 4.49°C/W, while power dissipation ratings measure up to 16.7 W at 75°C ΔT in natural convection. http://www.cui.com