Electronic Products & Technology

Fuse meets packing density challenges in power electronics

August 8, 2017  Stephen Law

SCHURTER USN 1206 SMD fuse technology meets challenges associated with packing density in power electronics. The chip fuse provides temperature-sensitivity suitable for both overcurrent protection and protection against excessive ambient temperatures. Device is not a pure thermal fuse, as it requires a current flow to blow, thus providing protection against overcurrent, just as well as any conventional fuse. Device also protects power semiconductors in automotive applications against over-temperature. The fuse has a current-time characteristic which shifts as a function of the ambient temperature. The 12A current rated device has high I2t values at 32Vdc and a slow blowing characteristic. Device has a breaking capacity of 80A at 32Vdc and 170A at 16Vdc with an operating temperature range of a -40C to a +125C.


Print this page

Related Stories

Leave a Reply

Your email address will not be published. Required fields are marked *

*