Fuse meets packing density challenges in power electronics
SCHURTER USN 1206 SMD fuse technology meets challenges associated with packing density in power electronics. The chip fuse provides temperature-sensitivity suitable for both overcurrent protection and protection against excessive ambient temperatures. Device is not a pure thermal fuse, as it requires a current flow to blow, thus providing protection against overcurrent, just as well as any conventional fuse. Device also protects power semiconductors in automotive applications against over-temperature. The fuse has a current-time characteristic which shifts as a function of the ambient temperature. The 12A current rated device has high I2t values at 32Vdc and a slow blowing characteristic. Device has a breaking capacity of 80A at 32Vdc and 170A at 16Vdc with an operating temperature range of a -40C to a +125C.