Electronic cooling software simplifies model creation

Future Facilities 6SigmaET next generation of electronic cooling software streamlines model creation, gridding, solving and post-processing. An automated process is used to completely convert incoming computer aided design data to intelligent objects such as the chips, capacitors, resistors and other components on a printed circuit board, and complex shaped heatsinks, etc. A heatsink can be snapped onto a chip and a chip can be snapped onto a board, eliminating much of the cumbersome positioning required with primitive-based electronics cooling software.

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