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Conductive adhesive cures fast at low temperature


HENKEL Hysol ECCOBOND CA3556HF silver-filled electrically conductive adhesive provides fast cure at low temperature. Product’s material suits high-throughput production processes and applications that dictate high peel strength, such as the photovoltaic module assembly market. Product delivers an excellent bond between the Ag and SnPbAg coated tabs and the c-Si cells.

 

http://www.henkel.com/electronics


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