December 3, 2012 - by EPT Magazine
Aluminum plate fin heatsinks suit BGA chipsets
RADIAN HEATSINKS HS1800 Series Aluminum Plate Fin BGA Heatsinks are high efficiency cooling products suitable for linear air flow environments. Devices mount with firm’s EZ Snap mounting clips and / or thermal tape to provide optimum cooling for various package sizes and airflow. The off-the-shelf solution is easy to install and requires no special board modifications or complex assemblies. Device provides low pressure-drop characteristics and is constructed of extruded aluminum AL6063.