November 21, 2012 - by EPT Magazine
Mini-oven reball/prebump unit serves QFN solder bumping process
MARTIN Mini-Oven Reball/Prebump unit and Expert 10.6 rework system is suitable for the complete QFN solder bumping process, even for the smallest pitches. Using a unique Hotprint Technology, the mask is not removed after printing paste, but remains on the QFN during reflow. The reballing function is capable of handling a diverse range of BGAs, as well as QFNs and CSPs. Processes can be completed in as little as three minutes. The simple Rapid Technology soldering profiles rigorously apply settings within the permitted thermal limits, heat at the highest advisable thermal ramp rates and maintain a safe temperature zone.