Engineering adhesives support manufacture of small, complex designs

BOSTIK Born2Bond engineering adhesive HMPUR (Hot Melt Polyurethane Reactive) and UV-CIPG ranges support the manufacture of smaller, more lightweight and increasingly complex consumer electronic devices that are also required to be recyclable and meet all relevant sustainability and safety regulations. Six products have been added to the Born2Bond range of high-performance HMPUR range to deliver precision, durability and speed of application. The range is flexible and elastic, delivers high bonding strength on multiple substrates, including plastic, glass and metal, and is available in multiple viscosities.

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