Electronic Products & Technology


Features


Feature
August 26, 2015 by Chris Loberg, senior technical marketing manager, Tektronix Inc.

Integrating and testing ZigBee modules

Table 1: Comparison of popular RF technologies.

Most Internet of Things projects are likely to involve some sort of wireless connectivity, typically Wi-Fi, Bluetooth or ZigBee. Despite its relatively low performance, ZigBee’s very low power consumption makes it well-suited for many IoT applications. While IoT is the

Feature
August 17, 2015 by Dan Stewart, vice president marketing, Allied Electronics Inc.

The connection is there. How will you exploit it?

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This article looks at the future of manufacturing and automation and discusses ways in which forward-thinking companies now have the capability to far more effectively leverage their manufacturing data, thanks to recent advances in hardware and networks.

Feature
August 10, 2015 by Chris McGean, Protocase Inc.

Student robotics teams compete in university rover challenge

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Four Canadian student robotics teams completed an impressive showing among the world’s most elite university robotics teams at the 2015 University Rover Challenge, held this past spring at the Mars Desert Research Station in southern Utah. Twenty-three student teams from

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July 13, 2015 by Robert Roush, product engineer & Paul Wood, advanced product applications manager, Metcal, a brand of OK International

The evolution of cleaning methods in the pcb reworking process

FIG 1: Removed pads.

Why contactless solder cleaning is rapidly replacing manual cleaning

Feature
July 1, 2015 by David Norton, TDK-Lambda technical marketing

Embedded power supplies for the home healthcare market

The 2x4" medical home healthcare product.

Rarely a day goes by without a news article commenting on the rise in healthcare costs, the strain on government run services and general affordability. Reports on the medical market forecast CAGRs (Compounded Average Growth Rates) for electronics, double or

Feature
June 24, 2015 by Randy White, product manager, Tektronix Inc.

Overcoming USB 3.1 compliance testing challenges

FIG. 1: Higher data rates and a new 128b/132b encoding scheme headline the changes in the USB 3.1 Gen 2 PHY.

SuperSpeed USB 3.1 is poised to take over as the newest version of this popular interface. This update boosts data transfer rates to 10Gb/s, compared with 5Gb/s for USB 3.0. Along with the higher speeds, additional changes such as the

Feature
June 18, 2015 by Vijay Choudhary, applications engineer, Texas Instruments

Selecting the right buck-boost converter for wide-VIN rails

Figure 1a

Introduction Buck-boost converters are needed in a variety of applications including USB Power Delivery (USB PD), industrial computer power supplies, LED drivers, and automotive infotainment. Traditionally, cascaded stages or multi-winding, single-stage topologies such as single-ended primary inductor converter (SEPIC) or

Feature
June 9, 2015 by Michael Rosenthal, marketing enablement manager responsible for Avnet Embedded's Sales Mastery Program

On premise vs. Cloud

Michael Rosenthal, marketing enablement manager responsible for Avnet Embedded's Sales Mastery Program.

Avnet serves up the final word

Feature
June 2, 2015 by EP&T Magazine

Digi-Key announces top leadership transition

Outgoing president and COO for Digi-Key Mark Larsen.

Mark Larson hands over the reins to Dave Doherty

Feature
May 19, 2015 by EP&T Magazine

The key to early 5G investigation – test tools for new network paradigms

Figure 1: Translating user demands into the network of the future.

The explosion of wireless data demand continues, with analysts predicting between 20 and 50-billion devices by the year 2020, ranging from M2M devices that transmit a few bytes per day to applications that stream multiple high definition video channels. Studies