Stacked silicon interconnect technology
Staff
Electronics CELXilinx's new stacked silicon interconnect technology enables a single FPGA device that delivers more of the FPGA resources customers need (logic, memory, serial transceivers and processing elements), while providing breakthrough capacity and bandwidth performance.
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The technology allows for multiple FPGA die to be combined and provides 100x improvement in inter-die bandwidth per watt over conventional approaches – ideal for applications such as next generation wired communications, high performance computing, and medical image processing.
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