Electronic Products & Technology

News

Stacked silicon interconnect technology

Xilinx's new stacked silicon interconnect technology enables a single FPGA device that delivers more of the FPGA resources customers need (logic, memory, serial transceivers and processing elements), while providing breakthrough capacity and bandwidth performance.



The technology allows for multiple FPGA die to be combined and provides 100x improvement in inter-die bandwidth per watt over conventional approaches – ideal for applications such as next generation wired communications, high performance computing, and medical image processing.

www.xilinx.com