Compared to traditional molded insulators, the .005 in. (0.13 mm) polyimide film carrier, employing near flush solder tail terminals (Type -210), reduces component height above the PC board by as much as 80%, down to .015 in. (0.38 mm). For board-to-board applications, standard spacing options range from .045 in. (1.14 mm) to .250 in. (6.35mm) with custom options available to suit virtually any application. Standard configurations such as DIP, SIP and PGA patterns are available.
For more CE Connectors, click here