The most significant innovation is a completely redesigned Z-axis motion mechanism that significantly reduces cycle time. These innovations and systems will be shown at SMTAI 2009 in San Diego, California, October 6 – 7.
The new Z-motion enhancement will be shown in the KISS-103 Selective Soldering system, on exhibit in Booth #402. The KISS-103 couples high throughput with precise process controls. The programmable features provide the tools to set all process parameters, including immersion depths, pre-heat dwells, travel distances and speeds, solder temperature and wave height. Once set, the system will repeat precisely. The KISS-103 will process a 18" x 24" board entirely without intervention.