Created for use by engineers, executives and others considering embedded passive technology, the document provides guidance for evaluating the technology, as well as general information on how to proceed with implementation.
Embedded passive technology originally emerged 20 years ago, and in recent years has seen new growth driven by miniaturization of packaging, higher frequencies and increased board density.
“Although much technical information is available about embedded passives, there was no easily available resource for conducting a preliminary cost-benefit analysis until now,” says Valerie St. Cyr, PCB technologist, Teradyne, Inc., and chair of the committee that developed the document. “This white paper provides a starting point for evaluating formed embedded passive technology, so a potential user can make a better-informed decision about whether it might be suitable for a particular application.”
The 20-page paper summarizes the technology of formed embedded passives, and addresses physical considerations, quality and reliability considerations, performance gains, implementation costs and cost advantages, and design impacts for circuit boards with embedded components. It features 24 figures and tables, many in full color, to help illustrate and clarify key information.
The member price is $25; nonmember price is $50.