Austin Semiconductor, Inc. announces the introduction of a high
integration product family. This family, based on integrated multiple
silicon devices, is manufactured on an organic laminate micro-substrate
and then encapsulated using industry standard plastic materials (iPEM).
This product packaging technology allows for highly integrated products
on a medium which exhibits improved space utilization, capacitance, and
inductance, as well as, excellent thermal properties and controlled
impedance over the monolithic building block approach.