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UV-CURE ENCAPSULANTS

The electronics group of Henkel has announced the launch of three UV-cure encapsulants for use in Smart Card IC module manufacturing.


The dam-and-fill products are to be marketed under Henkel’s Hysol brand and are named Hysol 3323, Hysol 3327 and Hysol 3329. Developed using single-component epoxy technology, these encapsulants provide fast curing times, improved adhesion, minimized tape warpage and perform well during reliability testing.
henkel.com


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