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EPOXY MOLD COMPOUND

Hysol GR9810 epoxy molding compound is designed for use as an overmold on a variety of laminate-based molded array packages including SIP and flip-chip array packages that have been conventionally underfilled.


The extremely flat nature of the product allows for the entire package to be processed in a non-warped state, which minimizes subsequent steps in the manufacturing process and can result in higher end-of-the-line yields. Unique product characteristics of Hysol GR9810 include ultra low warpage, the ability to underfill small ICs and passive components and superior adhesion to various laminate substrates.
Henkel Technologies


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