The Chip Packaging Toolkit for Pulsonix PCB design software provides the option to create and annotate die, bond pads and bond wires, and also allows the automatic placing of bond pads around bare die components.
June 19, 2004
Online DRC (design rule check) and batch design rules can be set for minimum and maximum length of the bond pad from the die pad, and for crossing over of insulated and non-insulated wires.
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